• limerod@reddthat.comOP
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    4 months ago

    TL;DR

    • Samsung is reportedly working on a new cooling solution for future Exynos smartphone processors.
    • This packaging tech is apparently derived from PCs and servers and sees a type of heatsink attached to the top of the processor.
    • Work on the tech could be completed by Q4 2024, suggesting the Exynos 2500 could potentially use it.