QCM6490 is their long term support chip (8 years), the product was released in 2021. That means we have until 2028 for security updates.
UPDATE: 2028 is the official support timeline from Qualcomm.
The fairphone five releases in 2023, claims 10 years of updates until 2033.
There is a 6 year gap in Qualcomms QCM6490 support window and FairPhones support window. Baseband security will get abandoned with 6 years left on the clock. Rough.
I think this is exactly the problem that caused GrapheneOS to initially reject the earlier fair phones.
https://www.qualcomm.com/products/internet-of-things/industrial/building-enterprise/qcm6490
“Long term support for Android OS upgrades, Linux, Ubuntu, Windows 11 IoT Enterprise, security updates and enterprise grade hardware.”
Updated Reference: https://arstechnica.com/gadgets/2023/08/fairphone-5-sets-a-new-standard-with-8-10-years-of-android-support/
Yeah that’s not really great. But what could they do about it?
Just be upfront about it.
We have hardware security updates until 2029, and software updates until 2033. We will do everything in our power to keep the phone safe and useful as long as we can.
Hiding away in ambiguous language and lying by omission isn’t fair.
Yeah that’s totally true!
Kinda annoyed that their “live” event, is a bunch of pre-recorded videos.
lol… it just finished, just pre-recorded videos.
Yeah haha
I would like to see a well rounded phone that makes sense for anyone. And I really hope they stick to a from factor at some point over multiple generations, so parts are interchangable/upgradable between them.
They just showed a model tear apart breakaway on the stream, doesn’t look modular at all.
I see, they say “modular” but they mean “user replaceable”…
In general when I hear modular I think you could put in a variety of modules, not a single module. (like different cameras, different screens, different SOC, etc…)
So these modules will most likely NOT be compatible across phones.
That’s how Fairphones have worked since their first model I think? It just means you can replace specific modules if something breaks, rather than having to replace the entire mainboard. They’ve also done a camera upgrade for existing phones in the past that way
FP3 Had an upgradable camera (basically the difference between that and FP3+) I think their specs are open though? 3rd party suppliers could make parts that are compatible
I mean if the potential Fairphone 6 uses the same parts, but with better components on them, it would be really nice already
Sure, then we would see a modular interface to make the component fit into any phone. What they showed was very specific moulding and cable runs designed exactly for the current phone layout. It’s highly unlikely these modules will be cross compatible with any other phone.
this would be really nice, see a commitment to modularity.