As far as I read LPCAMM in its current state does not work for this. The electrical noise is too high. These things aren’t the same. A repairable waterproof phone can be made without glue by making it a bit thicker. In the case of RAM today, we’re hitting fundamental physics limitations with speed of electricity and noise. At this point the physical interconnect itself becomes a problem. Gold contact points become antennas that induce noise into adjacent parts of the system. I’m not trying to excuse Framework here. I’m saying that the difficulty here borders on the impossible. If this RAM was soldered and it had bandwidth no different than SODIMM or LPCAMM modules then I’d say Framework fucked up making it soldered, majorly. As I said, there’s no point buying this if you don’t care about the fast RAM and use cases that need it like LLMs. Regular ITX board with regular AM5 is the way to go.
E: To be clear, if this bandwidth could be achieved with LPCAMM, then Framework fucked up.
As far as I read LPCAMM in its current state does not work for this. The electrical noise is too high. These things aren’t the same. A repairable waterproof phone can be made without glue by making it a bit thicker. In the case of RAM today, we’re hitting fundamental physics limitations with speed of electricity and noise. At this point the physical interconnect itself becomes a problem. Gold contact points become antennas that induce noise into adjacent parts of the system. I’m not trying to excuse Framework here. I’m saying that the difficulty here borders on the impossible. If this RAM was soldered and it had bandwidth no different than SODIMM or LPCAMM modules then I’d say Framework fucked up making it soldered, majorly. As I said, there’s no point buying this if you don’t care about the fast RAM and use cases that need it like LLMs. Regular ITX board with regular AM5 is the way to go.
E: To be clear, if this bandwidth could be achieved with LPCAMM, then Framework fucked up.